News
How to implement CSP/BGA bottom potting
Through the above schematic diagram of the BGA soldering process, we can find that after the BGA chip is soldered, there is enough space at the bottom of the PCB and the ...Show Details
What basic requirements should epoxy resin potting material meet?
Epoxy resin potting materials should meet the following basic requirements: good performance, long pot life, suitable for mass automatic production line operations; low ...Show Details
Features of BGA package
Show DetailsApplication of Potting Technology in BGA Assembly
With the increasing number of packaged devices such as Flip-Chip and BGA, the number of spherical pins of this type of device has increased, forcing the size of the solde...Show Details
Analysis of the Causes of Tin Beads in Printing
Show Details
Analysis and countermeasures of related causes of poor component placement
Analysis and countermeasures of related causes of poor component placement
Show Details
