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SMT bad cause analysis and countermeasures!
The uneven printing of solder paste and the amount of solder paste will cause Manhattan (tombstone) phenomenon. Too little solder paste printing or patch offset can easil...Show Details
SMT dispensing curing control process
When printing glue, add a small amount multiple times. After production, the glue on the steel mesh can no longer be used. The glue still in the package should not be use...Show Details
SMT reflow soldering process
Requirements for the temperature recovery curve of solder paste:
The current reference temperature curve of solder paste MULTICORE and KESTER:
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SMT placement machine component placement process 1
The positioning and clamping device of the PCB board must be in a normal state, and there must be no looseness or foreign objects, otherwise it will cause inaccurate posi...Show Details
How to avoid soldering defects such as bridging, tin bead, and less tin?
How to avoid soldering defects such as bridging, tin bead, and less tin? Pay attention to the following factors:
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