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Actual case analysis of solving BGA CSP ball and socket defect (Head-In-Pillow)
Head-In-Pillow: There is no complete wetting between the solder ball and the solder paste during the reflow stage.
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Factors affecting the placement rate of SMT equipment and analysis of common failures of placement machines
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12 simple tips for improving PCB desoldering process
In fact, every welding operation will not be a perfect assembly. Even the highest quality components can fail from time to time. This is why desoldering is very important...Show Details
Analysis of the factors causing the temperature rise of the printed circuit board and its solutions
We all know that the heat generated by electronic equipment during operation causes the internal temperature of the equipment to rise rapidly
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Efficiently use BGA signal routing technology in PCB design
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Various inspection standards for PCBA soldering appearance inspection!
Inspection preparation The inspector must wear anti-static gloves and a watch, prepare calipers, electrical performance parameter instruments and other tools;
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