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Selective soldering of fine pitch components on high heat capacity components 2
The main challenge for soldering fine pitch components is bridgeless soldering. For some components with high heat capacity, through-hole filling may also be difficult. I...Show Details
Selective soldering of fine pitch components on high heat capacity components
In the past ten years, the number of through-hole components on printed circuit boards (PCBs) has dropped significantly.
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Cause analysis and control method of BGA "solder joint" false welding
In order to get a good printing effect, fresh solder paste is used in the production, and it is stirred evenly before printing, and the printing position is accurate. The...Show Details
Analysis of the causes of "virtual welding"
Analyzing the problems that occurred in actual production, it is believed that the possible reasons for the formation of "virtual welding" are as follows.
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Types and design standards of pads in PCB design 2
Design standards for pads in PCB design 1. The shape and size design standard of PCB pad 1. The minimum single side of all pads is not less than 0.25mm, and the maximum d...Show Details
Types and design standards of pads in PCB design
Let’s learn about the types of pads and the design standards of pads in PCB design today. The land, the basic unit of surface mount assembly, is used to form the land pa...Show Details
