How to Adjust Wave Soldering Wave Height
Wave soldering uses molten liquid solder to form a solder wave of a specific shape on the liquid surface of the solder bath by the action of the pump. The PCB on which the components are inserted is placed on the transmission chain and passes through a specific angle and a certain immersion Depth passes through the solder wave to realize the process of solder joint soldering. In the wave soldering process, the wave height adjustment of wave soldering is also an important link. Let's share how to adjust the wave height of wave soldering, wave soldering machine, DIP soldering, selective soldering machine.
Wave soldering
In essence, we adjust the shape of different peaks to find this "balance point" to meet different customer needs. (This is what we often call the "de-sinking point") Generally speaking, simple PCBs do not have high requirements on the peaks, and complex PCB boards have strict requirements on the peaks. In terms of high-density mixed boards, the T component requires the first peak to provide a trapezoidal high shock wave that can be soldered for 2 seconds to correspond to the shielding effect; the package and the mating component require a solderable time of 3-4 seconds "Stable Crest". Each component basically puts forward requirements for the solder wave according to its own characteristics. Packages and strips with large heat capacity are suitable for advection waves, while strips with small heat similar to the package are suitable for arc waves. .
Wave
1. The wave nozzle should be adjusted as low as possible to reduce the tin drop and tin slag;
2. The distance between the first wave nozzle and the second wave nozzle is kept at the same distance from the titanium claw when the guide rail angle is fixed;
3. As far as possible, use a flat wave for the second wave, that is, the flow is not large after the middle baffle is not adjusted, and a little tin flow is sufficient. The shape of this wave is flat and the wave is stable, but it depends on the actual situation;
4. Pay attention to the height and angle of the diversion groove between the two waves;
5. Under the condition that the connection of the connection and the insertion of the plug-in line is smooth, adjust the guide rail angle to 5.5 degrees;
6, the tin temperature is too high, in case of moisture or solvent, immediately burst, so the tin furnace temperature needs to be lowered.
7. If the preheating temperature is too low, water vapor or solvent will be evaporated. Once the substrate enters the tin furnace, it will be in contact with the high temperature for a moment, which will cause a burst. Therefore, the preheating temperature needs to be increased.
After the component and the PCB are soldered in the solder, the peaks need to provide a relatively stable, balanced state without external interference when they are separated from the peaks. For a simple PCB, if there are no fine-pitch design components, the stability of the wave surface will not adversely affect the soldering. But for the components with fine-pitch pins, ETA believes that when the component pins are separated from the wave peak, due to the capillary effect, the solder is separated by the pad and the lead at a "relatively balanced point", "A certain point of relative balance" refers to the moment when the component is de-tinned. The forward and backward flows of the wave crest and the transport speed are a set of balancing forces, and there is no disturbance on the wave surface and the state of cross flow. Wet on the surface to be welded under the action.