Wave Soldering Equipment Process

 

ETA, a professional wave soldering machine, selective wave soldering machine, wave soldering equipment manufacturer. Professional solution and engineering team.

Wave soldering equipment refers to the flow of molten solder (tin-containing solder) through a mechanical pump or electromagnetic pump to form a solder wave, which causes the PCB with pre-installed components to pass through the solder wave to realize the soldering ends or pins of the components A soldering process for mechanical and electrical connection with PCB jacks / pads.

1) Process characteristics

(1) Apply solder and heat to the PCB.

(2) The application of heat is mainly conducted through the molten solder, and the amount of heat applied to the PCB mainly depends on the temperature of the molten solder and the contact time (solder time) between the molten solder and the PCB.

(3) The size and fillability of the solder joint mainly depend on the design of the pad, the installation gap between the hole and the lead. In other words, the size of wave soldering joints depends mainly on the design.

(4) Welding SMD has a "shading effect" and is prone to leak welding. The so-called "shadow effect" refers to the phenomenon that the chip SMD package prevents the solder wave from contacting the pad / solder.

2) Process flow

Dispensing → patching → curing → wave soldering

❙ Wave Soldering Equipment Video